| EXEMPTION |
EXPIRY DATE |
| 6(a). Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight. |
Expires on 11 December 2026 |
| 6(a)-I..Lead as an alloying element in steel for machining purposes containing up to 0.35% lead by weight and in batch hot dip galvanised steel components containing up to 0.2% lead by weight. |
Expires on 30 June 2027 for all categories |
| 6(a)- II. Lead as an alloying element in batch hot-dip galvanised steel components containing up to 0,2 % lead by weight. |
Expires on 30 June 2027 for all categories |
| 6(b). Lead as an alloying element in aluminium containing up to 0.4 % lead by weight |
Expires on 11 June 2027 |
| 6(b)-I. Lead as an alloying element in aluminium containing up to 0,4 % lead by weight, provided it stems from lead-bearing aluminium scrap recycling |
Expires on 11 December 2026 for categories 1-7, 10
Expires on 30 June 2027 for categories 9 industrial monitoring and control instruments, and 11. |
| 6(b)-II. Lead as an alloying element in aluminium for machining purposes with a lead content up to 0,4 % by weight |
Expires on 11 June 2027 for categories 1-7, 10
Expires on 30 June 2027 for categories 9 industrial monitoring and control instruments and 11 (*) |
| 6(b)-III. Lead as an alloying element in aluminium casting alloys containing up to 0,3 % lead by weight provided it stems from lead-bearing aluminium scrap recycling (*1) |
Expires on 30 June 2027 for categories 1-8, 9 other than industrial monitoring and control instruments, and 10. |
| 6(c). Copper alloy containing up to 4% lead by weight |
Expires on 30 June 2027. |
| 7(a). Lead in high melting temperature type solder (i.e. lead-based alloys containing 85% by weight or more lead) |
Applies to all categories (except applications covered by point 24 of this Annex) and expires on 30 June 2027. |
7(a)-I. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
For internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0,1 A or greater or blocking voltages beyond 10 V, or die edge sizes larger than 0,3 mm × 0,3 mm |
Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. |
7(a)-II. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
For integral (meaning internal and external) connections of die attach in electrical and electronic components, if all the following conditions are met:
- The thermal conductivity of the cured/sintered die-attach material is > 35 W/(m × K),
- The electrical conductivity of the cured/sintered die-attach material is > 4,7 MS/m, solidus melting temperature is higher than 260 °C
|
Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. |
7(a)-III. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
In first-level solder joints (internal or integral connections – meaning internal and external) for manufacturing components, so that subsequent mounting of electronic components onto subassemblies (i.e. modules, sub-circuit boards, substrates, or point-to-point soldering) with a secondary solder does not reflow the first-level solder. This sub-entry excludes die attach applications and hermetic sealings |
Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. |
7(a)-IV. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
In second-level solder joints for the attachment of components to a printed circuit board or lead frames:
- in solder balls for the attachment of ceramic ball-grid-array (BGA);
- in high temperature plastic overmouldings (> 220 °C)
|
Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. |
7(a)-V. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
As a hermetic sealing material between:
- a ceramic package or plug and a metal case;
- component terminations and an internal sub-part
|
Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. |
7(a)-VI. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
For establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating, high intensity discharge lamps, or oven lamps |
Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. |
7(a)-VII. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
For audio transducers where the peak operating temperature exceeds 200 °C |
Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. |
| 7(b). Lead in solder for servers, storage array systems, network infrastructure equipment for switching, signaling transmission, and network management for telecommunications. |
21 July 2023 for category 8 in vitro diagnostic medical devices
21 July 2024 for category 9 industrial monitoring and control instruments, and for category 11
Other categories - expired |
| 7(c)-I. Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound |
Applies to all categories and expires on 30 June 2027. |
| 7(c)-II. Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher |
Applies to all categories (except applications covered by point 7(c)-I or 7(c)-IV) and expires on 31 December 2027.’ |
7(c) -V. Electrical and electronic components containing lead in a glass or glass matrix compound that fulfils any of the following functions:
- for protection and electrical insulation in glass beads of high-voltage diodes and glass layers for wafers;
- for hermetic sealing between ceramic, metal and/or glass parts;
- for bonding purposes in a process parameter window for < 500°C combined with a viscosity of 1,013.3 dPas (‘glass-transition temperature’);
- for use as a resistive material such as ink, with a resistivity range from 1 ohm/square to 100 megohm/square, excluding trimmer potentiometers;
- for use in chemically modified glass surfaces for microchannel plates (MCPs), channel electron multipliers (CEMs) and resistive glass products (RGPs).
|
Applies to all categories and expires on 31 December 2027. |
7(c)-VI. Electrical and electronic components containing lead in a ceramic that fulfils any of the following functions:
- for use in piezoelectric lead zirconium titanate (PZT) ceramics;
- for providing ceramics with a positive temperature coefficient (PTC).
|
Applies to all categories (except applications covered by points 7(c)-II, 7(c)-III and 7(c)-IV of this Annex, as well as point 14 of Annex IV) and expires on 31 December 2027.’ |